BUK7880-55(2011) Просмотр технического описания (PDF) - NXP Semiconductors.
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BUK7880-55 Datasheet PDF : 13 Pages
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NXP Semiconductors
BUK7880-55
N-channel TrenchMOS standard level FET
5. Thermal characteristics
Table 5.
Symbol
Rth(j-sp)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to solder point
thermal resistance from
junction to ambient
Conditions
mounted on any printed-circuit
board
Mounted on FR4 PCB,
mounting pad for drain 6.5 cm2
Min Typ Max Unit
-
12
15
K/W
-
-
70 K/W
102
Zth(j-mb)
(K/W)
10
1
δ = 0.5
0.2
0.1
0.05
0.02
003aaf271
P
δ = tp
T
10−1
0
10−2
10−6 10−5
10−4
10−3
10−2
tp
T
10−1
t
1 10
tp (s)
Fig 5. Transient thermal impedance from junction to solder point as a function of pulse duration
BUK7880-55
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 April 2011
© NXP B.V. 2011. All rights reserved.
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