Philips Semiconductors
4. Thermal characteristics
Table 3: Thermal characteristics
Symbol Parameter
Rth(j-a)
thermal resistance from junction to
ambient
Rth(j-mb) thermal resistance from junction to
mounting base
Conditions
Figure 4
4.1 Transient thermal impedance
BUK9214-75B
TrenchMOS™ logic level FET
Min Typ Max Unit
-
71.4 -
K/W
-
0.45 1.0 K/W
1
Zth(j-mb)
(K/W)
δ = 0.5
0.2
0.1
10-1
0.05
0.02
10-2
single shot
10-3
10-6
10-5
10-4
10-3
10-2
03nl34
P
δ
=
tp
T
tp
t
T
10-1
tp (s)
1
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
9397 750 10801
Objective data
Rev. 01 — 10 December 2002
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
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