Description
The MOC223-M consists of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon photodarlington detector, in a surface mountable, small outline, plastic package. It is ideally suited for high density applications, and eliminates the need for through the board mounting.

FEATUREs
■ U.L. Recognized (File #E90700, Volume 2)
■ VDE Recognized (File #136616) (add option “V” for VDE approval, i.e, MOC223V-M)
■ Industry Standard SOIC-8 Surface Mountable Package with 0.050" lead spacing
■ High Current Transfer Ratio of 500% Minimum at IF = 1mA
■ Standard SOIC-8 Footprint, with 0.050" Lead Spacing
■ Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering
■ High Input-Output Isolation Voltage of 2500 VAC(rms) Guaranteed

APPLICATIONs
■ Low power logic circuits
■ Interfacing and coupling systems of different potentials and impedances
■ Telecommunications equipment
■ Portable electronics
■ Solid state relays