PHM15NQ20T Просмотр технического описания (PDF) - Philips Electronics

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PHM15NQ20T

TrenchMOS™ standard level FET

Philips Electronics 

Philips Semiconductors

8. Soldering

handbook, full pagewidth

6.00

5.90

4.60

3.85

0.50 (8×)

0.75 (8×)

PHM15NQ20T

TrenchMOS™ standard level FET

0.075

0.150

0.050

Cu covered

with solder resist

solder lands

solder resist

clearance

solder paste

placement area

occupied area

7.25 7.00

1.525

2.30

0.05 SP around (4×)

0.40

2.60

5.40

6.25

Dimensions in mm.

Fig 15. Reflow soldering footprint for SOT685-1 (QLPAK).

2.025

3.45

2.175 2.35

2.50

6.40

1.905

1.40

0.40

0.15

1.27

0.60 (4×)

0.85 (4×)

MGX371

9397 750 11845

Product data

Rev. 03 — 11 September 2003

© Koninklijke Philips Electronics N.V. 2003. All rights reserved.

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