PTN3460 Просмотр технического описания (PDF) - NXP Semiconductors.

Номер в каталоге

Компоненты Описание

Список матч

PTN3460

eDP to LVDS bridge IC

NXP Semiconductors. 

NXP Semiconductors

PTN3460

eDP to LVDS bridge IC

2.5 General

 Power supply: with on-chip regulator

 3.3 V  10 % (integrated regulator switched on)

 3.3 V  10 %, 1.8 V  5 % (integrated regulator switched off)

 ESD: 8 kV HBM, 1 kV CDM

 Operating temperature range: 0 C to 70 C

 HVQFN56 package 7 mm  7 mm, 0.4 mm pitch; exposed center pad for thermal relief

and electrical ground

3. Applications

 AIO platforms

 Notebook platforms

 Netbooks/net tops

4. System context diagram

Figure 1 illustrates the PTN3460 usage.

CPU/GPU/ eDP

CHIP SET

PTN3460

DP to LVDS

BRIDGE

LVDS

MOTHERBOARD

notebook or AIO platform

cable

LVDS PANEL

Fig 1. PTN3460 context diagram

002aaf831

5. Ordering information

Table 1. Ordering information

Type number

Topside mark

PTN3460BS/Fx[1][2] PTN3460BS[3]

Package

Name

HVQFN56

Description

plastic thermal enhanced very thin quad flat package;

no leads; 56 terminals; body 7  7  0.85 mm[4];

0.4 mm pitch

Version

SOT949-2

[1] PTN3460BS/Fx is firmware-specific, where the ‘x’ indicates the firmware version.

[2] Notes on firmware and marking:

a) Firmware versions are not necessarily backwards compatible.

b) Box/reel labels will indicate the firmware version via the orderable part number (for example, labeling will indicate PTN3460BS/F1 for

firmware version 1). A sample label is illustrated in Figure 8.

[3] Topside marking is limited to PTN3460BS and will not indicate the firmware version.

[4] Maximum package height is 1 mm.

PTN3460

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 4 — 12 March 2014

© NXP Semiconductors N.V. 2014. All rights reserved.

3 of 32

Share Link: