FEATURES
■ Access Times 70, 85, 100ns
■ Evolutionary, Corner Power/Ground Pinout
■ Packaging:
    • 32 pin, Hermetic Ceramic DIP (Package 300)
■ Organized as two banks of 512Kx8
■ Commercial, Industrial and Military Temperature Ranges
■ 3.3V Power Supply
■ Low Power CMOS
■ TTL Compatible Inputs and Outputs
■ Output Enable Internally tied to GND.