Description and Applications
The MA4P7461F-1072T is a surface mountable PIN diode in a Non-Magnetic (patent pending) Metal Electrode Leadless Faced (MELF) package. The device incorporates M/A-COM’s proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM’s new non-magnetic plating process to provide an extremely low permeability, hermetically sealed package. Incorporated in the package is a passivated PIN diode that is full face bonded on both the cathode and anode of the chip to maximize surface area for lower electrical and thermal resistance. The MA4P7461F-1072T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. This MA4P7461F-1072T non-magnetic device is similar in electrical performance to the MA4P1250-1072T and the MA4P7101F-1072T magnetic part numbers.

FEATUREs
♦ Non-Magnetic Package Suitable for MRI
   Applications
♦ Rectangular MELF SMQ Ceramic Package
♦ Hermetically Sealed
♦ Lower Rs for Lower Series Loss
♦ Longer τL for Lower Intermodulation Distortion
♦ Lower Cj for Higher Series Isolation
♦ Higher Average Incident Power Handling
   Capability