Features
• Isolated Substrate
    − high isolation voltage (>2500V)
    − excellent thermal transfer
    − Increased temperature and power cycling capability
• IXYS advanced low Qg process
• Low gate charge and capacitances
    − easier to drive
    − faster switching
• Low RDS(on)
• Very low insertion inductance (<2nH)
• No beryllium oxide (BeO) or other hazardous materials

Advantages
• High Performance Push-Pull RF Package
• Optimized for RF and high speed switching at frequencies to >65MHz
• Easy to mount—no insulators needed
• High power density