CP237 Даташит - Central Semiconductor
Номер в каталоге
CP237
Компоненты Описание
Other PDF
no available.
PDF
page
2 Pages
File Size
198.1 kB
производитель
Central Semiconductor
PROCESS DETAILS
Process EPITAXIAL PLANAR
Die Size 30 x 30 MILS
Die Thickness 9.0 MILS
Base Bonding Pad Area 4.4 x 12.5 MILS
Emitter Bonding Pad Area 4.4 x 12.5 MILS
Top Side Metalization Al - 30,000Å
Back Side Metalization Au - 12,000Å
Номер в каталоге
Компоненты Описание
PDF
производитель
Small Signal Transistor NPN - Saturated Switch Transistor Chip ( Rev : 2002 )
Central Semiconductor
Small Signal Transistor PNP- Saturated Switch Transistor Chip
Central Semiconductor Corp
Small Signal Transistor PNP - Saturated Switch Transistor Chip ( Rev : 2002 )
Central Semiconductor
Share Link: