STP60NS04ZB
1
Electrical ratings
Electrical ratings
Table 1. Absolute maximum ratings
Symbol
Parameter
VDS
VGS
ID
ID
IDG
IGS
IDM(1)
Ptot
Drain-source voltage (VGS = 0)
Gate- source voltage
Drain current (continuous) at TC = 25°C
Drain current (continuous) at TC = 100°C
Drain gate current (continuous)
Gate source current (continuous)
Drain current (pulsed)
Total dissipation at TC = 25°C
Derating factor
Gate-source ESD
VESD(G-S) (HBM - C = 100pF, R=1.5 kΩ)
Gate-drain ESD
VESD(G-D) (HBM - C = 100pF, R=1.5 kΩ)
VESD(D-S)
Drain-source ESD
(HBM - C = 100pF, R=1.5 kΩ)
Tstg
Storage temperature
Tj
Max. operating junction temperature
1. Pulse width limited by safe operating area.
Value
Clamped
Clamped
60
42
±50
±50
240
150
1
6
4
4
-65 to 175
Unit
V
V
A
A
mA
mA
A
W
W/°C
KV
KV
KV
°C
Table 2. Thermal data
Rthj-case Thermal resistance junction-case max
Rthj-amb Thermal resistance junction-ambient max
TJ
Maximum lead temperature for soldering purpose
1
°C/W
62.5
°C/W
300
°C
Symbol
Parameter
Avalanche current, repetitive or not-repetitive
IAR
(pulse width limited by Tj max)
Single pulse avalanche energy
EAS
(starting Tj = 25 °C, ID = IAR, VDD = 30 V)
Max Value
Unit
60
A
400
mJ
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