NXP Semiconductors
BUK9207-30B
N-channel TrenchMOS logic level FET
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
mounting base
thermal resistance
from junction to
ambient
Conditions
see Figure 4
Min Typ Max Unit
-
-
0.95 K/W
-
71.4 -
K/W
1
δ = 0.5
Zth(j-mb)
(K/W) 0.2
0.1
10−1
0.05
0.02
03nk52
10−2
single shot
P
δ = tp
T
10−3
10−6
10−5
10−4
10−3
10−2
tp
t
T
10−1
1
tp (s)
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
BUK9207-30B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 16 June 2010
© NXP B.V. 2010. All rights reserved.
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