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ESDALC5-4BN4 Просмотр технического описания (PDF) - STMicroelectronics

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ESDALC5-4BN4 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
ESDALC5-4BN4
3
Package information
Package information
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 3. µQFN-4L dimensions
Dimensions
Ref.
Millimeters
Inches
E
L
D
D2
e
21
Index
area
E2
3 4 L1
b
A
A1
Min. Typ. Max. Min. Typ. Max.
A 0.31 0.38 0.40 0.012 0.015 0.016
A1 0.00 0.02 0.05 0.00 0.0008 0.002
b 0.10 0.15 0.20 0.004 0.006 0.008
D 0.70 0.80 0.90 0.028 0.031 0.035
D2 0.50 0.58 0.65 0.020 0.023 0.026
e 0.35 0.40 0.45 0.014 0.016 0.018
E 0.90 1.00 1.10 0.035 0.039 0.043
E2 0.15 0.20 0.25 0.006 0.008 0.010
L 0.18 0.23 0.28 0.007 0.009 0.011
L1 0.00 - 0.05 0.00 - 0.002
Figure 10. Footprint dimensions (in mm) Figure 11. Marking
0.4
Note:
0.17
1.4
0.58
0.43
0.2
0.18
0.58
Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no
case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.
Doc ID 023686 Rev 1
5/10

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