W83176G-733 Просмотр технического описания (PDF) - Winbond

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W83176G-733

Dual Bank DDR BUFFER For VIA CHIPSET

Winbond 

W83176R-733/W83176G-733

DUAL BANK DDR BUFFER FOR VIA CHIPSET

Table of Content-

1. GENERAL DESCRIPTION ......................................................................................................... 1

2. PRODUCT FEATURES .............................................................................................................. 1

3. PIN CONFIGURATION ............................................................................................................... 1

4. BLOCK DIAGRAM ...................................................................................................................... 2

5. PIN DESCRIPTION..................................................................................................................... 3

5.1 Clock Function Pins..................................................................................................................3

5.2 Control Signal Pins...................................................................................................................3

6. POWER PINS ............................................................................................................................. 4

7. I2C CONTROL AND STATUS REGISTERS .............................................................................. 4

7.1 Register 0 ~ Register 5 RESERVED.......................................................................................4

7.2 Register 6: Output Control (1 = Enable, 0 = Disable) (Default: FFh)......................................4

7.3 Register 7: Output Control (1 = Enable, 0 = Disable) (Default: FFh)......................................4

7.4 REGISTER 8 ~ Register 17 RESERVED ...............................................................................5

7.5 Skew step reference Table ......................................................................................................5

7.6 Register 18: Skew Control (Default: 88h)................................................................................5

7.7 Register 19: Skew Control (Default: 80h)................................................................................5

7.8 Slew rate reference table .........................................................................................................6

7.9 Register 20: Skew & Slew Rate Control (Default: 8Ah) ..........................................................6

7.10 Register 21: Slew Rate Control (Default: AAh) .......................................................................6

7.11 Register 22: Slew Rate Control (Default: AAh) .......................................................................6

7.12 Register 23: Slew Rate Control (Default: AAh) .......................................................................7

8. ACCESS INTERFACE ................................................................................................................ 8

8.1 Block Write Protocol .................................................................................................................8

8.2 Block Read Protocol.................................................................................................................8

8.3 Byte Write Protocol...................................................................................................................8

8.4 Byte Read Protocol ..................................................................................................................8

9. SPECIFICATIONS ...................................................................................................................... 9

9.1 ABSOLUTE MAXIMUM RATINGS .........................................................................................9

9.2 AC CHARACTERISTICS.........................................................................................................9

9.3 DC CHARACTERISTICS ........................................................................................................9

10. ORDERING INFORMATION..................................................................................................... 10

11. HOW TO READ THE TOP MARKING...................................................................................... 10

12. PACKAGE DRAWING AND DIMENSIONS.............................................................................. 11

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