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STPS1H100-Y
Characteristics
Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMA)
Rth(j-a)(°C/W)
140
130
Epoxy printed circuit board FR4, copper thickness: 35 µm
120
110
100
90
80
70
60
50
40
30
S(Cu)(cm²)
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
SMA
4.5 5.0
Doc ID 17935 Rev 1
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