STPS1H100AY Просмотр технического описания (PDF) - STMicroelectronics
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STPS1H100AY Datasheet PDF : 9 Pages
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Characteristics
STPS1H100-Y
Figure 7.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Zth(j-c)/Rth(j-c)
1.00
SMB
Figure 8.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Zth(j-c)/Rth(j-c)
1.00
SMA
0.10
Single pulse
0.01
1.E-03
1.E-02
1.E-01
tp(s)
1.E+00 1.E+01
1.E+02
1.E+03
0.10
Single pulse
0.01
1.E-03
1.E-02
1.E-01
tp(s)
1.E+00 1.E+01
1.E+02
1.E+03
Figure 9.
Reverse leakage current versus
reverse voltage applied
(typical values)
IR(µA)
1.E+03
1.E+02
1.E+01
Tj=125 °C
1.E+00
1.E-01
1.E-02
1.E-03
0
Tj=25 °C
VR(V)
10 20 30 40 50 60 70 80 90 100
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
100
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
VR(V)
10
1
10
100
Figure 11. Forward voltage drop versus
Figure 12. Thermal resistance junction to
forward current (maximum values)
ambient versus copper surface
under each lead (SMB)
IFM(A)
100.00
10.00
1.00
Tj=125 °C
Tj=25 °C
0.10
VFM(V)
0.01
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Rth(j-a)(°C/W)
120
Epoxy printed circuit board FR4, copper thickness: 35 µm
110
100
90
80
70
60
50
40
30
S(Cu)(cm²)
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
SMB
4.5 5.0
4/9
Doc ID 17935 Rev 1
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