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W83196S-14 Просмотр технического описания (PDF) - Winbond

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W83196S-14 Datasheet PDF : 15 Pages
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Preliminary W83196S-14
8.0 SPECIFICATIONS
8.1 Absolute Maximum Ratings
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Maximum conditions for extended periods may affect reliability. Unused inputs
must always be tied to an appropriate logic voltage level (Ground or VDD).
PARAMETER
SYMBOL
RATING
Voltage on Any Pin with Respect to GND
Storage Temperature
Ambient Temperature
Operating Temperature
VDD, VIN
TSTG
TB
TA
-0.5V to +7.0V
-65° C to +150° C
-55° C to +125° C
0° C to +70° C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
device.
8.2 AC Characteristics
VDDR = VDDCore = VDDP = VDD4 = 3.3V ±5%, VDDA = VDDC = 2.5V ±5% , TA = 0°C to +70°C
PARAMETER
SYM. MIN. TYP. MAX. UNITS TEST CONDITIONS
Output Duty Cycle
45 50 55
% Measured at 1.5V
CPU to PCI Offset
tOFF
1
4
nS 15 pF Load Measured at
1.5V
Skew (CPU-CPU), (PCI-
PCI)
tSKEW
250 ps 15 pF Load Measured at
1.5V
Cycle to Cycle Jitter
tCCJ
CPU
tJA
Absolute Jitter
200 ps
500 ps
Jitter Spectrum 20 dB
Bandwidth from Center
BWJ
500 KHz
Output Rise (0.4V ~ 2.0V)
& Fall (2.0V ~0.4V) Time
Overshoot/Undershoot
Beyond Power Rails
tTLH
0.4
tTHL
Vover
0.7
1.6 nS 15 pF Load on CPU and
PCI outputs
1.5
V 22 at source of 8 inch
PCB run to 15 pF load
Ring Back Exclusion
VRBE 0.7
2.1
V Ring Back must not enter
this range.
Publication Release Date: March 1999
-9-
Revision A1

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