W83178S Просмотр технического описания (PDF) - Winbond

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W83178S

100 MHZ 3-DIMM SDRAM BUFFER

Winbond 

10. PACKAGE DIMENSIONS

28-pin SOP

Preliminary W83178S

Headquarters

Winbond Electronics (H.K.) Ltd.

No. 4, Creation Rd. III,

Science-Based Industrial Park,

Hsinchu, Taiwan

TEL: 886-3-5770066

FAX: 886-3-5792646

Rm. 803, World Trade Square, Tower II,

123 Hoi Bun Rd., Kwun Tong,

Kowloon, Hong Kong

TEL: 852-27513100

FAX: 852-27552064

http://www.winbond.com.tw/

Voice & Fax-on-demand: 886-2-27197006

Taipei Office

11F, No. 115, Sec. 3, Min-Sheng East Rd.,

Taipei, Taiwan

TEL: 886-2-27190505

FAX: 886-2-27197502

Winbond Electronics North America Corp.

Winbond Memory Lab.

Winbond Microelectronics Corp.

Winbond Systems Lab.

2727 N. First Street, San Jose,

CA 95134, U.S.A.

TEL: 408-9436666

FAX: 408-5441798

Note: All data and specifications are subject to change without notice.

Please note that all data and specifications are subject to change without notice. All the trade marks of products

and companies mentioned in this data sheet belong to their respective owners.

These products are not designed for use in life support appliances, devices, or systems where malfunction of

these products can reasonably be expected to result in personal injury. Winbond customers using or selling

these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any

damages resulting from such improper use or sale.

Publication Release Date: March 1999

-7-

Revision A1

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