MCM72FB8ML7.5R Просмотр технического описания (PDF) - Motorola => Freescale
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MCM72FB8ML7.5R Datasheet PDF : 20 Pages
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WRITE TRUTH TABLE
Cycle Type
Read
Read
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SGW SW
SBa
SBb SBc SBd SBe
SBf
SBg SBh
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ABSOLUTE MAXIMUM RATINGS (See Note 1)
Rating
Symbol
Value
Unit Notes
Power Supply Voltage
VDD VSS – 0.5 to + 4.6 V
I/O Supply Voltage
VDDQ VSS – 0.5 to VDD V
2
Input Voltage Relative to VSS for Vin, Vout
Any Pin Except VDD
VSS – 0.5 to
VDD + 0.5
V
2
Input Voltage (Three–State I/O)
VIT
VSS – 0.5 to
V
2
VDDQ + 0.5
Output Current (per I/O)
Iout
± 20
mA
Package Power Dissipation
PD
6.4
W
3
Ambient Temperature
TA
0 to 70
°C
Die Temperature
TJ
110
°C
3
Temperature Under Bias
Tbias
– 10 to 85
°C
Storage Temperature
Tstg
– 55 to 125
°C
NOTES:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
2. This is a steady–state DC parameter that is in effect after the power supply has
achieved its nominal operating level. Power sequencing is not necessary.
3. Power dissipation capability is dependent upon package characteristics and use en-
vironment. See Package Thermal Characteristics.
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to this high–impedance
circuit.
PACKAGE THERMAL CHARACTERISTICS
Thermal Resistance
Symbol
Max
Unit
Notes
Junction to Ambient (@ 200 lfm)
Single–Layer Board RθJA
19
°C/W
1, 2
Four–Layer Board
13
Junction to Board (Bottom)
RθJB
10
°C/W
3
Junction to Case (Top)
RθJC
0.3
°C/W
4
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, board population, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883
Method 1012.1).
MCM72FB8ML MCM72PB8ML
6
MOTOROLA FAST SRAM
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