MAAPGM0041-DIE Просмотр технического описания (PDF) - Tyco Electronics
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MAAPGM0041-DIE Datasheet PDF : 6 Pages
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1.3W X/Ku-Band Power Amplifier
RFIN
100 pF
0.1 µF
RO-P-DS-3042 - - 6/6
MAAPGM0041-DIE
VDD
VDD
RFOUT
VGG
VGG
100 pF
0.1 µF
Figure 6. Recommended operational configuration. Wire bond as shown.
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent
damage to amplifier.
Specifications subject to change without notice.
Customer Service: Tel. (888)-563-3949
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
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