MAAPGM0041-DIE Просмотр технического описания (PDF) - Tyco Electronics
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MAAPGM0041-DIE Datasheet PDF : 6 Pages
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1.3W X/Ku-Band Power Amplifier
RO-P-DS-3042 - - 5/6
MAAPGM0041-DIE
Mechanical Information
Chip Size: 2.980 x 1.804 x 0.075 mm (117 x 71 x 3 mils)
1.804mm.
1.652mm.
0.852mm.
0.152mm.
0
0
VDD
VGG
0.852mm.
Figure 5. Die Layout
Bond Pad Dimensions
Pad
RF In and Out
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
Size (µm)
100 x 200
200 x 150
150 x 150
Size (mils)
4x8
8x6
6x6
Specifications subject to change without notice.
Customer Service: Tel. (888)-563-3949
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
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