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AD8387 Просмотр технического описания (PDF) - Analog Devices

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AD8387 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
AD8387
APPLICATIONS
OPTIMIZED RELIABILITY WITH THE THERMAL
SWITCH
While internal current limiters provide short-term protection
against temporary shorts at the outputs, the thermal switch
provides protection against persistent shorts lasting for several
seconds. To optimize reliability with the use of the thermal
switch, the following sequence of operations is recommended.
INITIAL POWER-UP AFTER ASSEMBLY OR REPAIR
Grounded output mode is disabled, and thermal switch is
enabled. Ensure that the GSW pin is HIGH and that the
TSW pin is HIGH upon initial power-up and that they remain
unchanged throughout this procedure.
The initial power-up sequence follows:
1. Execute the initial power-up.
2. Identify any shorts at outputs. Power down, repair shorts,
and repeat the initial power-up sequence until proper system
functionality is verified.
3. Disable the thermal switch.
POWER-UP DURING NORMAL OPERATION
Grounded output mode is disabled, and thermal switch is
disabled.
If TSW = LOW and GSW = HIGH, all outputs go into normal
operating mode with the thermal switch disabled.
POWER SUPPLY SEQUENCING
As indicated under the Absolute Maximum Ratings, the voltage
at any input pin cannot exceed its supply voltage by more than
0.5 V. Power-on and power-off sequencing can be required to
comply with the absolute maximum ratings.
Failure to comply with the Absolute Maximum Ratings can
result in functional failure or damage to the internal ESD
diodes. Damaged ESD diodes can cause temporary parametric
failures, which can result in image artifacts. Damaged ESD
diodes cannot provide full ESD protection, reducing reliability.
POWER-ON SEQUENCE
1. Turn on AVCC
2. Turn on VRH
3. Turn on VRL
4. Turn on DVCC
5. Disable thermal switch: TSW = LOW
6. Turn on input signals
POWER-OFF SEQUENCE
1. Turn off input signals
2. Turn off VRL
3. Turn off VRH
4. Turn off AVCC
5. Turn off DVCC
GROUNDED OUTPUT MODE DURING POWER-OFF
Certain applications require that video outputs be held near
AGND during power-down. The following power-off sequence
ensures that the outputs are near ground during power-off and
that the Absolute Maximum Ratings are not violated.
1. Enable grounded output mode: GSW = LOW
2. Turn off input signals
3. Turn off VRL
4. Turn off VRH
5. Turn off AVCC
6. Turn off DVCC
PCB DESIGN FOR OPTIMIZED THERMAL
PERFORMANCE
Although the maximum safe operating junction temperature is
higher, the AD8387 is 100% tested at a junction temperature of
125°C. Consequently, the maximum guaranteed operating
junction temperature is 125°C. To limit the maximum junction
temperature at or below the guaranteed maximum, the package
in conjunction with the PCB must effectively conduct heat away
from the junction.
The AD8387 package is designed to provide enhanced thermal
characteristics through the exposed die paddle on the bottom
surface of the package. To take full advantage of this feature, the
exposed paddle must be in direct thermal contact with the PCB,
which then serves as a heat sink.
A thermally effective PCB must incorporate two thermal
pads and a thermal via structure. The thermal pad on the top
surface of the PCB provides a solderable contact surface on the
top surface of the PCB. The thermal pad on the bottom PCB
layer provides a surface in direct contact with the ambient. The
thermal via structure provides a thermal path to the inner and
bottom layers of the PCB to remove heat.
Rev. 0 | Page 14 of 16

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