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AD8341 Просмотр технического описания (PDF) - Analog Devices

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AD8341 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
AD8341
OUTLINE DIMENSIONS
4.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
TOP
VIEW
3.75
BSC SQ
1.00 12° MAX
0.85
0.80
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.50
BSC
0.50
0.40
0.30
0.60 MAX
PIN 1
INDICATOR
19
24 1
18
EXPOSED
PAD
(BOTTOM VIEW)
13
12
6
7
2.25
2.10 SQ
1.95
0.25 MIN
2.50 REF
SEATING
PLANE
0.30
COPLANARITY
0.23 0.20 REF
0.08
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2
Figure 44. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body (CP-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
AD8341ACPZ-WP1, 2 −40°C to +85°C
AD8341ACPZ-REEL72 −40°C to +85°C
AD8341-EVAL
Package Description
24-Lead Lead Frame Chip Scale Package (LFCSP)
24-Lead Lead Frame Chip Scale Package (LFCSP)
Evaluation Board
Package Option
CP-24-1
CP-24-1
Order Multiple
64
1,500
1
1 WP = Waffle pack.
2 Z = Pb-free part.
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and regis-
tered trademarks are the property of their respective owners.
D04700–0–7/04(0)
Rev. 0 | Page 20 of 20

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