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STPS1H100MF

High voltage power Schottky rectifier

STMicroelectronics 

STPS1H100MF

2

Package information

Package information

● Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

Table 5. STmite flat dimensions

Dimensions

Ref.

Millimeters

Inches

Min. Typ. Max. Min. Typ. Max.

L1

A 0.80 0.85 0.95 0.031 0.033 0.037

E1

L

L2

b 0.40 0.55 0.65 0.016 0.022 0.026

Db

b2 0.70 0.85 1.00 0.027 0.033 0.039

b2

c 0.10 0.15 0.25 0.004 0.006 0.009

L3

E

c

D 1.75 1.90 2.05 0.069 0.075 0.081

E 3.60 3.80 3.90 0.142 0.150 0.154

A

E1 2.80 2.95 3.10 0.110 0.116 0.122

L 0.50 0.55 0.80 0.020 0.022 0.031

L1 2.10 2.40 2.60 0.083 0.094 0.102

L2 0.45 0.60 0.75 0.018 0.024 0.030

L3 0.20 0.35 0.50 0.008 0.014 0.020

Figure 11. STmite flat recommended footprint (all dimensions in mm)

0.85 0.63 2.00 0.65

0.65

0.95 1.95

4.13

5/7

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