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STPS1H100

High voltage power Schottky rectifier

STMicroelectronics 

Package information

2

Package information

STPS1H100

● Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

Figure 17. SMA package dimensions

E1

D

E

A1

C

A2

L

b

Dimensions

Ref

Millimeters

Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b

1.25 1.65 0.049 0.065

c

0.15 0.40 0.006 0.016

D

2.25 2.90 0.089 0.114

E

4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L

0.75 1.50 0.030 0.059

Figure 18. SMA footprint dimensions in Figure 19. Marking information

millimeters (inches)

1.4

(0.055)

2.63

(0.103)

5.43

(0.214)

1.4

(0.055)

1.64

(0.064)

Cathode bar (unidirectional devices only )

e3

xxx

z y ww

e3: ECOPACK ( Leadfree)

XXX: Marking

Z: Manufacturing location

Y: Year

WW: week

6/10

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