FS61850-01 Просмотр технического описания (PDF) - AMI Semiconductor
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FS61850-01 Datasheet PDF : 10 Pages
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AMERICAN MICROSYSTEMS, INC.
November 2000
FS61850-01
1:10 HSTL SMBus Zero-Delay Clock Buffer IC
Advance Information
6.0 Package Information
Table 11: 48-pin TSSOP (6.1mm) Package Dimensions
DIMENSIONS
INCHES
MILLIMETERS 48
MIN. MAX. MIN. MAX.
A
-
0.047
-
1.20
A1 0.002 0.006
b 0.0067 0.011
c 0.0035 0.008
D 0.488 0.496
0.05
0.17
0.09
12.40
0.15
0.27
0.20
12.60
AMERICAN MICROSYSTEMS, INC.
E1 E
E
0.318 BSC
8.10 BSC
E1 0.236 0.244 6.00
6.20
1
e
0.019 BSC
0.50 BSC
L 0.018 0.030 0.45
0.75
b
S 0.008
-
0.20
-
θ1
0°
8°
0°
8°
θ2
12° REF
12° REF
e
D
SEATING PLANE
A
c
S
θ2
A1
L
θ3
θ1
θ3
12° REF
12° REF
Table 12: 48-pin TSSOP (6.1mm) Package Characteristics
PARAMETER
Thermal Impedance, Junction to Free-Air
Lead Inductance, Self
Lead Inductance, Mutual
Lead Capacitance, Bulk
Lead Capacitance, Mutual
SYMBOL
ΘJA
L11
L12
L13
C11
C12
C13
CONDITIONS/DESCRIPTION
Air flow = 0 m/s
Longest lead
Longest lead to any 1st adjacent lead
Longest lead to any 2nd adjacent lead
Longest lead to VSS
Longest lead to any 1st adjacent lead
Longest lead to any 2nd adjacent lead
TYP.
89
3.50
1.82
1.17
0.63
0.30
0.03
UNITS
°C/W
nH
nH
pF
pF
ISO9001
QS9000
9
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