FEATURES
■ Access Times of 15*, 17, 20ns
■ Low Voltage Operation
■ Packaging
   • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402)
   • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fi t JEDEC 68 lead 0.990" CQFJ footprint
■ Organized as 512Kx32; User Confi gurable as 1Mx16 or 2Mx8
■ Radiation Tolerant with Epitaxial Layer Die
■ Commercial and Industrial Temperature Ranges
■ 3.3V Power Supply
■ BiCMOS
■ TTL Compatible Inputs and Outputs
■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation
■ Weight
   • WS512K32BV-XG2XE - 8 grams typical
   • WS512K32NBV-XH2XE - 13 grams typical