256Kx32 SRAM MODULE
FEATURES
■Access Times 20, 25, 35ns
■MIL-STD-883 Compliant Devices Available
■Packaging
• 66 pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP (Package 401)
• 68 lead, 40mm, Hermetic CQFP (Package 501)
■Organized as 256Kx32, User Configurable as 512Kx16
■Upgradable to 512Kx32 for future expansion
■Data I/O Compatible with 3.3V devices
■2V Data Retention devices available (WS256K32L-XXX low power version only)
■Commercial, Industrial and Military Temperature Range
■5 Volt Power Supply
■Low Power CMOS
■TTL Compatible Inputs and Outputs
■Weight
WS256K32N-XHX - 13 grams typical
WS256K32-XG4X - 20 grams typical