FEATURES
* Access Times of 15, 17, 20, 25, 35, 45, 55ns
* MIL-STD-883 Compliant Devices Available
* Packaging
   -  66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400)
   -  68 lead, 40mm CQFP (G4T), 3.56mm (0.140"), (Package 502).
-  68 lead, 22.4mm CQFP (G2T), 4.57mm (0.180"), (Package 509)
-  68 lead, 22.4mm Low Profile CQFP (G1U), 3.57mm (0.140"), (Package 519)
* Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8
* Low Power Data Retention - only available in G2T package type
* Commercial, Industrial and Military Temperature Ranges
* 5 Volt Power Supply
* Low Power CMOS
* TTL Compatible Inputs and Outputs
* Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation
* Weight:
  WS128K32-XG1UX - 5 grams typical
  WS128K32-XG2TX - 8 grams typical
  WS128K32-XH1X - 13 grams typical
  WS128K32-XG4TX - 20 grams typical
* All devices are upgradeable to 512Kx32