FEATURES
■Access Times 15, 17, 20, 25, 35, 45, 55ns
■MIL-STD-883 Compliant Devices Available
■Revolutionary, Center Power/Ground Pinout JEDEC Approved
  •36 lead Ceramic SOJ (Package 100)
  •36 lead Ceramic Flat Pack (Package 226)
■Evolutionary, Corner Power/Ground Pinout JEDEC Approved
  •32 pin Ceramic DIP (Package 300)
  •32 lead Ceramic SOJ (Package 101)
  •32 lead Ceramic Flat Pack (Package 220)
  •32 lead Ceramic Flat Pack (Package 142)
■32 pin, Rectangular Ceramic Leadless Chip Carrier (Package 601)
■Commercial, Industrial and Military Temperature Range
■5 Volt Power Supply
■Low Power CMOS
■Low Power Data Retention for Battery Back-up Operation
■TTL Compatible Inputs and Outputs