Wire Bonding Silicon Vertical Capacitor

The IPDiA Technology is the most appropriate solution for Chip On Board, Chip On Foil, Chip On Glass, Chip On Ceramic, Flip Chip and Embedded Applications, when designers are looking at Utmost Decoupling Behaviours.
This silicon based technology is RoHS compliant and compatible with lead free reflow soldering process.

KEY FEATUREs
• Full Compatible to Monolithic Ceramic Capacitors
• Low Profile
• Ultra High Stability of Capacitance Value;
   • Temperature <±1% (-55 to +150°C)
   • Voltage < 0.1 % / V
   • Negligible Capacitance Loss through Ageing
• Custom Sizes, Values, Shapes, Tolerances and Higher Voltage
• Low Leakage Current down to 100pA

Key Applications
• Any Demanding Applications, such as Medical, Aerospace, Automotive Industrial.
• Applicable for Standard Wire Bonding Approach ( Ball and Wedge)
• High Reliability Applications
• Decoupling / Filtering / Charge Pump (ie. Pacemakers, Defibrillators)
• Downsizing