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W25Q32JVSTIQ Даташит - Winbond

25Q32JVAIQ image

Номер в каталоге
W25Q32JVSTIQ

Компоненты Описание

Other PDF
  2014  

PDF
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page
76 Pages

File Size
1.3 MB

производитель
Winbond
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GENERAL DESCRIPTIONS
The W25Q32JV (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down.


FEATURES
● New Family of SpiFlash Memories
   – W25Q32JV: 32M-bit / 4M-byte
   – Standard SPI: CLK, /CS, DI, DO
   – Dual SPI: CLK, /CS, IO0, IO1
   – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
   – Software & Hardware Reset(1)
● Highest Performance Serial Flash
   – 133MHz Single, Dual/Quad SPI clocks
   – 266/532MHz equivalent Dual/Quad SPI
   – 66MB/S continuous data transfer rate
   – Min. 100K Program-Erase cycles per sector
   – More than 20-year data retention
● Efficient “Continuous Read”
   – Continuous Read with 8/16/32/64-Byte Wrap
   – As few as 8 clocks to address memory
   – Allows true XIP (execute in place) operation
   – Outperforms X16 Parallel Flash
● Low Power, Wide Temperature Range
   – Single 2.7V to 3.6V supply
   – <1µA Power-down (typ.)
   – -40°C to +85°C operating range
● Flexible Architecture with 4KB sectors
   – Uniform Sector/Block Erase (4K/32K/64K-Byte)
   – Program 1 to 256 byte per programmable page
   – Erase/Program Suspend & Resume
● Advanced Security Features
   – Software and Hardware Write-Protect
   – Special OTP protection(2)
   – Top/Bottom, Complement array protection
   – Individual Block/Sector array protection
   – 64-Bit Unique ID for each device
   – Discoverable Parameters (SFDP) Register
   – 3X256-Bytes Security Registers
   – Volatile & Non-volatile Status Register Bits
● Space Efficient Packaging
   – 8-pin SOIC/VSOP 208-mil
   – 8-pad WSON 6x5-mm, XSON 4x4-mm
   – 16-pin SOIC 300-mil
   – 8-pin PDIP 300-mil
   – 24-ball TFBGA 8x6-mm (6x4 ball array)
   – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
   – Contact Winbond for KGD and other options


Номер в каталоге
Компоненты Описание
PDF
производитель
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