Features
◇ Glass passivated junction chip
◇ For surface mounted application
◇ Low profile package
◇ Built-in strain relief
◇ Ideal for automated placement
◇ Easy pick and place
◇ Ultrafast recovery time for high efficiency
◇ Low forward voltage, low power loss
◇ High temperature soldering guaranteed:
   260°C/10 seconds on terminals
◇ Plastic material used carries Underwriters
   Laboratory Classification 94V0