Features
● For surface mounted applications in order to optimize board space
● Ideal for automated placement
● Glass Passivated Chip Junction
● High temperature soldering : 260°C/10 seconds at terminals
● Lead‐free & halogen‐free parts, RoHS compliant

Mechanical Data
● Case: Molded plastic over passivated junction
● Terminals: Solder plated solderable per MIL‐STD‐750 Method 2026
● Polarity: Color band denotes cathode end
● Weight: approx.. 0.0173 grams