FEATURES
Lead less chip form, no lead damage
Lead-free solder joint, no wire bond & lead frame
Low power loss, high efficiency
High current capability, low VF
Plastic package has underwriters laboratory flammability
       Classification 94V-0

APPLICATION
Switching mode power supply applications
Portable equipment battery applications
High frequency rectification
DC / DC converter
Telecommunication

MECHANICAL DATA
Case: Packed with FRP substrate and epoxy underfilled
Terminals: Pure tin-plated (lead-free), solderable per MIL-STD-750, method 2026.
Polarity: Laser cathode band marking
Weight : 0.003 gram