FEATURES
• Glass passivated chip junction
• Ultrafast recovery times
• Soft recovery charateristics
• Low switching losses, high efficiency
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum
    peak of 245 °C (for TO-263AB package)
• Solder dip 260 °C, 40 s (for TO-220AC and
    ITO-220AC package)
• Component in accordance to RoHS 2002/95/EC
    and WEEE 2002/96/EC
   
TYPICAL APPLICATIONS
    For use in high voltage, high frequency power factor
    correctors, switching mode power supplies,
    freewheeling diodes and secondary dc-to-dc
    rectification application.