FEATURES
• Power pack
• Glass passivated pellet chip junction
• Ultrafast recovery time
• Soft recovery characteristics
• Low switching losses, high efficiency
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)
• Solder dip 275 °C max., 10 s per JESD 22-B106 (for TO-220AC and ITO-220AC package)
• AEC-Q101 qualified

TYPICAL APPLICATIONS
For use in high voltage and high frequency power factor correction, freewheeling diodes and secondary DC/DC rectification application.