Description
The STTS424E02 is targeted for DIMM modules in mobile personal computing platforms (laptops), server memory modules and other industrial applications. The thermal sensor (TS) in the STTS424E02 is compliant with the JEDEC specification JC 42.4, which defines memory module thermal sensors requirements for mobile platforms. The 2 Kb serial presence detect (SPD) I2C-compatible electrically erasable programmable memory (EEPROM) in the STTS424E02 is organized as 256 x 8 bits and is functionally identical to the industry standard M34E02.

FEATUREs
■ STTS424E02 includes a JEDEC JC 42.4
   compatible temperature sensor, integrated
   with industry standard 2 Kb serial presence
   detect (SPD) EEPROM (STTS2002 is
   recommended for new designs)

Temperature sensor
■ Temperature sensor resolution:
   0.25 °C (typ)/LSB
■ Temperature sensor accuracy:
   – ± 1 °C from +75 °C to +95 °C
   – ± 2 °C from +40 °C to +125 °C
   – ± 3 °C from –40 °C to +125 °C
■ ADC conversion time: 125 ms (max)
■ Supply voltage: 2.7 V to 3.6 V
■ Maximum operating supply current: 210 µA
   (EEPROM standby)
■ Hysteresis selectable set points from: 0, 1.5, 3,
   6.0 °C
■ Ambient temperature sensing range: –40 °C to
   +125 °C

2 Kb SPD EEPROM
■ Functionality identical to ST’s M34E02 SPD
   EEPROM
■ Permanent and reversible software data
   protection for the lower 128 bytes
■ Single supply voltage: 2.7 V to 3.6 V
■ Byte and page write (up to 16 bytes)
■ Self-time WRITE cycle (5 ms, max)
■ Automatic address incrementing
■ Operating temperature range:
   – –40 °C to +85 °C (DA package only)
   – –40 °C to +125 °C (DN package only)

Two-wire bus
■ 2-wire SMBus/I2C - compatible serial interface
■ Temperature sensor supports SMBus timeout
■ Supports up to 400 kHz transfer rate

Packages
■ DN: 2 mm x 3 mm TDFN8, height: 0.80 mm
   (max). Compliant to JEDEC MO-229,
   WCED-3.
■ DA: 2 mm x 3 mm DFN8, height: 0.90 mm
   (max). Contact local ST sales office for
   availability.
■ RoHS compliant, halogen-free