FEATURES
• Glass passivated chip junction
• Fast switching for high efficiency
• Low forward voltage drop
• Low leakage current
• High forward surge capability
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC

TYPICAL APPLICATIONS
For use in fast switching rectification of power supply, inverters, converters and freewheeling diodes for consumer and telecommunication.

Note
• These devices are not AEC-Q101 qualified.