Connectors - reduces costs in the production process

SL-SMT 3.5 is the high temperature resistant pin header for the 3.5 mm pitch range specially developed to be compatible with Reflow production processes. Existing pcb connector headers cannot withstand the high temperatures experienced in Reflow soldering - up to 260 °C. The SL-SMT has been designed using LCP (Liquid Crystal Polymer) which is stable at these high temperatures.
In addition, convential assembly of pcb modules requires both Wave soldering for standard THT (Through-Hole-Technology) components like pcb connector headers;  and then Reflow soldering for the SMT  (Surface-Mount-Technology) components.  With the SL-SMT, which uses THR technology, the Wave solder operation is not needed.  The shorter THR solder pins offer the flexibility of SMT components but achieve a mechanical strength of 10x that of “Gull Wing” SMT components. This additional strength is of great importance for pcb connectors where connection operations put strain onto standard SMT solder joints.

Advantages:
● up to 30% reduction in the number of
   production steps required
● stable at 260 °C - compatible for
   Convection and Vapour-phase Reflow
   soldering
● compatible for automatic “Pick-and-Place”
● THR gives 10x greater strength than 
   “Gull Wing” SMT
● placement on both sides of pcb possible