Features
• Schottky Barrier Chip
• Guard Ring Die Construction for Transient Protection
• High Current Capability
• Low Power Loss, High Efficiency
• High Surge Current Capability
• For Use in Low Voltage, High Frequency Inventers,
   Free Wheeling, and Polarity Protection Applications
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request

Mechanical Data
• Case: Low Profile Molded plastic
• Terminals: Plated leads solderable per MIL-STD-750,
   Method 2026 guaranteed
• Polarity: Color band or cathode Notch
• Mounting Position: Any
• Weight: 0.21grams(approx)