производитель
![SMC](/logo/SMC.png)
Sangdest Microelectronic (Nanjing) Co., Ltd
![SMC](data:image/gif;base64,R0lGODlhAQABAIAAAAAAAP///yH5BAEAAAAALAAAAAABAAEAAAIBRAA7)
Features:
• Schottky Barrier Chip
• Ideally Suited for Automatic Assembly
• Low Power Loss, High Efficiency
• For Use in Low Voltage Application
• Guard ring Die Construction
• Plastic Case Material has UL Flammability Classification Rating 94F-0
• Green products in compliance the ROHS directive
• This is a Pb − Free device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request
Mechanical Data:
• Case: Low Profile Molded plastic
• Terminals: Plated leads solderable per MIL-STD-750, Method 2026 guaranteed
• Polarity: Color band or cathode Notch
• Mounting Position: Any
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