4:1 ULTRA WIDE INPUT RANGE UP TO 2.01 WATTS

FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS
   ACCORDING IPC J-STD-020D
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT