FEATURES
• Glass passivated chip junction
• Excellent clamping capability
• 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 %
• Very fast response time
• Low incremental surge resistance
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS
    Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial and telecommunication.