[Dongguan Pingjingsemi Technology Co., Ltd.]

FEATURES
◆ For surface mount applications
◆ Glass passivated chip junction
◆ Low profile package
◆ Easy to pick and place
◆ Lead free in comply with EU RoHS2011/65/EU directives

MECHANICAL DATA
◆ Case: SMBF molded plastic body
◆ Terminals: Solderable per MIL-STD-750， Method 2026
◆ Weight: Approximated 0.057 grams