Description and Applications
The MA4P7470F-1072T is a surface mountable PIN diode in a non-magnetic Metal Electrode Leadless Faced (MELF) package. The device incorporates M/A-COM Technology Solutions time proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM Technology Solutions new non-magnetic plating process to provide a hermetically sealed package with extremely low permeability. Incorporated within the package is a glass passivated PIN chip that is full face bonded on both the cathode and anode to maximize surface area for low electrical and thermal resistance. The low thermal resistance provides excellent performance at high incident power levels of up to 200 watts CW. The MA4P7470F-1072T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. The MA4P7470F-1072T is a non-magnetic device which has similar electrical performance to its magnetic counterpart the MA4P7417F-1072T. The diode is well suited for use in low loss, low distortion, high power switching circuits. It was designed to be used in a high magnetic field environment from HF through UHF frequencies. This device is designed to meet the most rigorous electrical and mechanical requirements of MRI environments.

FEATUREs
• Non-Magnetic Package Suitable for MRI
   Applications
• Rectangular MELF SMQ Ceramic Package
• Hermetically Sealed
• Low Rs for Low Insertion Loss
• Long τL for Low Intermodulation Distortion
• Low Cj for High Series Isolation
• High Average Incident Power Handling
   Capability
• RoHS Compliant