Features
• package: standard SMT footprint 0603, colorless diffused resin
• feature of the device: smallest package 1.7 x 0.8 x 0.65 mm (LxWxH); more light due to higher optical efficiency
• wavelength: 470 nm (blue)
• viewing angle: 150°
• technology: ThinGaN®
• optical efficiency: 7 lm/W
• grouping parameter: luminous intensity, wavelength, forward voltage
• assembly methods: suitable for all SMT assembly methods
• soldering methods: IR reflow soldering and TTW soldering
• preconditioning: acc. to JEDEC Level 2
• taping: 8 mm tape with 5000/reel, ø180 mm
• ESD-withstand voltage: ESD sensitive device

APPLICATIONs
• flat backlighting (LCD, cellular phones, switches, displays)
• toys
• signal and symbol luminary
• marker lights (e.g. steps, exit ways, etc.)