HiPerFET Power MOSFETs
Single MOSFET Die
FEATUREs
• International standard packages
• Low RDS (on) HDMOSTM process
• Rugged polysilicon gate cell structure
• Unclamped Inductive Switching (UIS) rated
• Low package inductance
- easy to drive and to protect
• Fast intrinsic rectifier
APPLICATIONs
• DC-DC converters
• Synchronous rectification
• Battery chargers
• Switched-mode and resonant-mode power supplies
• DC choppers
• Temperature and lighting controls
• Low voltage relays
Advantages
• PLUS 247TMpackage for clip or spring mounting
• Space savings
• High power density