Features
✧ Glass passivated junction chip.
✧ For surface mounted application
✧ Low forward voltage drop
✧ Low profile package
✧ Fast switching for high efficiency
✧ Built-in stain relief, ideal for automatic
   placement
✧ High temperature soldering:
   260℃ /10 seconds at terminals
✧ Meet MSL level 1, per J-STD-020D,
   lead free maximum peak of 260℃
✧ Plastic material used carries Underwriters
   Laboratory Classification 94V-0
✧ Green compound with suffix "G" on packing
   code & prefix "G" on datecode

Mechanical Data
✧ Cases: Molded plastic
✧ Terminal: Pure tin plated, lead free
✧ Polarity: Indicated by cathode band
✧ Packing: 16mm tape per EIA STD RS-481
✧ Weight: 0.21 grams