Description
These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression bonding techniques. The top metallization is a layer of gold for a tarnish free surface that allows either thermosonic or thermocompression bonding techniques. The bottom metallization is also gold, suitable for epoxy or eutectic die attach method.

FEATUREs
• Thermocompression/Thermosonically Bondable
• Ideal for Hybrid Integrated Circuits
• Gold Metallization
• Silicon Nitride Passivation
• Uniform Electrical Characteristics
• Batch Matched Versions Available
• Planar Construction

APPLICATIONs
   These small signal, general purpose PIN/NIP diode chips
   are optimized for various analog and digital applications
   such as switches, digital phase shifters, pulse and amplitude 
   modulators, limiters, leveling, and attenuating.