FEATURES
• Planar die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• High temperature soldering : 260°C /10 seconds at terminals
• Glass package has Underwriters Laboratory Flammability
   Classification
• In compliance with EU RoHS 2002/95/EC directives

MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Axial leads, solderable per MIL-STD-202G, Method 208
• Polarity: See Diagram Below
• Mounting position:Any
• Weight: 0.13 gram